IPC Assembly Standards for Engineers
These BGA Voids would fail IPC-610 Ever since the creation of the printed circuit board. Engineers and manufacturers required a way to ensure proper functionality as well as reliability. This…
These BGA Voids would fail IPC-610 Ever since the creation of the printed circuit board. Engineers and manufacturers required a way to ensure proper functionality as well as reliability. This…
Solder joints are one of, if not the most crucial factor in whether or not your design and PCB functions properly. A large chunk of issues during assembly and testing…
PCB Surface Finishes Breakdown PCB surface finishes on a bare board may seem like an insignificant decision at the buying step of your product development but understanding the variations and…
Warpage in PCB and PCBAs Have you noticed that a particular board is no longer flat after assembly? Or maybe that a bare board that you received isn't exactly flush?…
PCB Assembly Inspection and Testing Options As technology advances and PCBAs become more complex, the testing and inspection options for these boards must carefully be taken into consideration. PCBs are…
As electronics get smaller and smaller, electronic component manufacturers have innovated in order to keep pace. BGAs are one way to increase connection density and keep PCB footprints small. What…