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Read more about the article IPC Assembly Standards for Engineers

IPC Assembly Standards for Engineers

  • Post author:Dan Shapiro
  • Post published:January 20, 2021

These BGA Voids would fail IPC-610 Ever since the creation of the printed circuit board. Engineers and manufacturers required a way to ensure proper functionality as well as reliability. This…

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Read more about the article Engineer’s Guide to Solder Joints

Engineer’s Guide to Solder Joints

  • Post author:Dan Shapiro
  • Post published:December 23, 2020

Solder joints are one of, if not the most crucial factor in whether or not your design and PCB functions properly. A large chunk of issues during assembly and testing…

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Read more about the article Top PCB Surface Finishes and Which to Use

Top PCB Surface Finishes and Which to Use

  • Post author:Dan Shapiro
  • Post published:December 15, 2020

PCB Surface Finishes Breakdown PCB surface finishes on a bare board may seem like an insignificant decision at the buying step of your product development but understanding the variations and…

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Read more about the article Causes of Warped PCB and PCB Assemblies

Causes of Warped PCB and PCB Assemblies

  • Post author:Kevin Nguyen
  • Post published:December 7, 2020

Warpage in PCB and PCBAs Have you noticed that a particular board is no longer flat after assembly? Or maybe that a bare board that you received isn't exactly flush?…

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Guide to PCB Assembly Inspection and Testing Options

  • Post author:Kevin Nguyen
  • Post published:October 29, 2020

PCB Assembly Inspection and Testing Options As technology advances and PCBAs become more complex, the testing and inspection options for these boards must carefully be taken into consideration. PCBs are…

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What is a BGA (Ball Grid Arrays) for Circuit Boards

  • Post author:Dan Shapiro
  • Post published:October 21, 2020

As electronics get smaller and smaller, electronic component manufacturers have innovated in order to keep pace. BGAs are one way to increase connection density and keep PCB footprints small. What…

Continue ReadingWhat is a BGA (Ball Grid Arrays) for Circuit Boards
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Recent Posts

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    Electrostatic Discharge’s (ESD) Affects on PCBs
    September 20, 2022/
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    Engineer’s Guide to Metal Core PCBs
    September 14, 2022/
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  • Importance of NPI (New Product Introduction) in PCBs
    Importance of NPI (New Product Introduction) in PCBs
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  • Services
    • PCB Assembly
    • Cable & Wire Harness Assembly​
    • Material Procurement​
    • Sub-Assembly & Box Build​
    • Test Engineering
    • Project Management​
  • Quality
  • About Us
  • Resources
    • FAQ
    • Vinatronic Kitting Guidelines
    • Resistor Color Code Guide
    • Sample PCB Assembly BOM
  • Blog
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