IPC Assembly Standards for Engineers
These BGA Voids would fail IPC-610 Ever since the creation of the printed circuit board. Engineers and manufacturers required a way to ensure proper functionality as well as reliability. This…
Engineer’s Guide to Solder Joints
Solder joints are one of, if not the most crucial factor in whether or not your design and PCB functions properly. A large chunk of issues during assembly and testing…
Top PCB Surface Finishes and Which to Use
PCB Surface Finishes Breakdown PCB surface finishes on a bare board may seem like an insignificant decision at the buying step of your product development but understanding the variations and…
Causes of Warped PCB and PCB Assemblies
Warpage in PCB and PCBAs Have you noticed that a particular board is no longer flat after assembly? Or maybe that a bare board that you received isn't exactly flush?…
Guide to PCB Assembly Inspection and Testing Options
PCB Assembly Inspection and Testing Options As technology advances and PCBAs become more complex, the testing and inspection options for these boards must carefully be taken into consideration. PCBs are…
What is a BGA (Ball Grid Arrays) for Circuit Boards
As electronics get smaller and smaller, electronic component manufacturers have innovated in order to keep pace. BGAs are one way to increase connection density and keep PCB footprints small. What…